Winbond Electronics W66AQ6NBHAGJ TR

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Regular price Dhs. 10.41
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface LVSTL_06
Clock Frequency 1.867 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 100-VFBGA
Supplier Device Package 100-VFBGA (10x7.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

High-Performance LPDDR4X Mobile DRAM for Mission-Critical Applications

The Winbond W66AQ6NBHAGJ TR is a high-reliability 1Gbit LPDDR4X SDRAM designed for demanding embedded systems in aerospace, automotive, industrial, medical, and telecommunications sectors. This mobile DRAM delivers exceptional performance with a 1.867 GHz clock frequency while maintaining low power consumption, making it ideal for battery-powered and energy-efficient applications.

Key Benefits & Features

  • Superior Performance: 1.867 GHz clock frequency with 3.6 ns access time ensures rapid data processing for real-time applications
  • Extended Temperature Range: Operates reliably from -40°C to 105°C (TC), perfect for harsh industrial and automotive environments
  • Low Power Consumption: LPDDR4X technology optimized for mobile and embedded systems requiring energy efficiency
  • High Reliability: Manufactured by Winbond Electronics with stringent quality standards for mission-critical applications
  • Compact Form Factor: 100-VFBGA (10x7.5mm) surface mount package saves valuable PCB space
  • RoHS Compliant: Environmentally friendly and meets international regulatory standards

Ideal Applications

This LPDDR4X SDRAM is perfectly suited for:

  • Aerospace avionics and flight control systems
  • Automotive infotainment, ADAS, and autonomous driving platforms
  • Industrial automation and control systems
  • Medical imaging and diagnostic equipment
  • Telecommunications infrastructure and 5G base stations
  • High-performance embedded computing modules

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