Winbond Electronics W66AQ6NBUAFJ TR

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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface LVSTL_06
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66AQ6NBUAFJ TR - High-Performance Mobile LPDDR4X DRAM Memory

The W66AQ6NBUAFJ TR from Winbond Electronics is a premium 1Gbit LPDDR4X mobile DRAM memory solution engineered for mission-critical applications across aerospace, automotive, industrial, medical, and telecommunications sectors. This high-reliability semiconductor delivers exceptional performance with a 1.6GHz clock frequency and ultra-fast 3.6ns access time, making it ideal for demanding embedded systems and mobile computing platforms.

Key Features & Benefits

  • High-Speed Performance: 1.6GHz clock frequency with 3.6ns access time ensures rapid data processing
  • Optimized Memory Architecture: 64M x 16 organization provides efficient data handling for mobile applications
  • Extended Temperature Range: -40°C to 105°C (TC) operation for harsh industrial environments
  • Low Power Consumption: Dual voltage supply (1.06V-1.17V, 1.7V-1.95V) optimizes energy efficiency
  • Compact Surface Mount Design: 200-WFBGA (10x14.5) package saves valuable board space
  • Industry Compliance: RoHS compliant for environmental responsibility

Applications

This LPDDR4X mobile DRAM is perfectly suited for:

  • Aerospace and defense systems requiring high reliability
  • Automotive infotainment and ADAS platforms
  • Industrial automation and control systems
  • Medical diagnostic equipment
  • Telecommunications infrastructure
  • Mobile computing and embedded applications

Why Choose Winbond W66AQ6NBUAFJ TR?

Winbond Electronics has established itself as a trusted leader in high-reliability semiconductor solutions. The W66AQ6NBUAFJ TR combines cutting-edge LPDDR4X technology with robust design engineering to deliver consistent performance in the most demanding environments. Whether you're designing next-generation automotive systems or mission-critical industrial equipment, this memory solution provides the speed, reliability, and efficiency your application demands.

Related Products & Resources

Explore our complete range of Memory Solutions for additional DRAM, SRAM, and flash memory options. Visit our homepage to discover our full catalog of high-reliability semiconductors. Stay informed about the latest product releases and industry insights by visiting our News Blog.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.