Winbond Electronics W66AQ6NBUAGJ
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 12.59 | Dhs. 12.59 |
| 15+ | Dhs. 12.20 | Dhs. 183.00 |
| 25+ | Dhs. 11.93 | Dhs. 298.25 |
| 50+ | Dhs. 11.27 | Dhs. 563.50 |
| 100+ | Dhs. 9.95 | Dhs. 995.00 |
| N+ | Dhs. 1.99 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tray | |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4X |
| Memory Size | 1Gbit |
| Memory Organization | 64M x 16 |
| Memory Interface | LVSTL_06 |
| Clock Frequency | 1.867 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 200-WFBGA |
| Supplier Device Package | 200-WFBGA (10x14.5) |
| ROHS |  |
Winbond W66AQ6NBUAGJ - High-Performance Mobile LPDDR4X SDRAM Memory IC
The Winbond W66AQ6NBUAGJ is a premium 1Gbit mobile LPDDR4X SDRAM memory integrated circuit engineered for mission-critical applications in mobile devices, automotive systems, and industrial equipment. This high-reliability semiconductor delivers exceptional performance with a 1.867 GHz clock frequency and ultra-fast 3.6 ns access time, making it ideal for bandwidth-intensive applications requiring rapid data processing.
Key Features & Benefits
- High-Speed Performance: 1.867 GHz clock frequency with 3.6 ns access time ensures rapid data throughput for demanding mobile and embedded applications
- Optimized Memory Architecture: 64M x 16 organization (1Gbit capacity) provides flexible memory configuration for diverse system requirements
- Low Power Consumption: Mobile LPDDR4X technology with dual voltage supply (1.06V-1.17V, 1.7V-1.95V) maximizes energy efficiency for battery-powered devices
- Extended Temperature Range: -40°C to 105°C (TC) operating range ensures reliable performance in harsh automotive and industrial environments
- Compact Surface Mount Package: 200-WFBGA (10x14.5mm) footprint optimizes board space utilization in space-constrained designs
- RoHS Compliant: Environmentally friendly manufacturing meets global regulatory standards
Applications & Use Cases
The W66AQ6NBUAGJ is specifically designed for:
- Mobile smartphones and tablets requiring high-bandwidth memory
- Automotive infotainment and ADAS (Advanced Driver Assistance Systems)
- Industrial IoT devices and embedded computing platforms
- Wearable technology and portable medical devices
- High-performance edge computing applications
Why Choose HQICKEY for Your Memory Components?
As an authorized distributor of Winbond Electronics and other leading semiconductor manufacturers, HQICKEY ensures 100% authentic components with full traceability and technical support. Our extensive inventory of high-reliability memory solutions supports just-in-time procurement for OEMs and contract manufacturers worldwide.
Related Products & Resources
Explore our complete range of memory semiconductor solutions including SRAM, Flash, EEPROM, and DRAM components from industry-leading manufacturers. Visit the HQICKEY homepage to discover our full catalog of aerospace, automotive, industrial, medical, and telecommunications components. Stay informed about the latest semiconductor technologies and industry insights on our NEWS blog.
Need technical assistance or volume pricing? Contact our engineering team for application notes, design resources, and custom procurement solutions tailored to your project requirements.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
