Skip to product information
1 of 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Regular price Dhs. 13.94
Regular price Dhs. 14.68 Sale price Dhs. 13.94
Sale Sold out
Quantity Unit Price Total Price
1 Dhs. 13.94 Dhs. 13.94
15+ Dhs. 13.51 Dhs. 202.65
25+ Dhs. 13.21 Dhs. 330.25
50+ Dhs. 12.48 Dhs. 624.00
100+ Dhs. 11.01 Dhs. 1,101.00
N+ Dhs. 2.20 Price Inquiry
Shipping calculated at checkout.
Quantity
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface LVSTL_11
Clock Frequency 2.133 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66BP6NBUAHJ - 2Gbit Mobile LPDDR4 SDRAM Memory IC

The W66BP6NBUAHJ from Winbond Electronics is a high-performance 2Gbit mobile LPDDR4 SDRAM designed for demanding applications in automotive, industrial, medical, and telecommunications sectors. Featuring a 128M x 16 memory organization and operating at 2.133 GHz, this memory IC delivers exceptional speed and reliability across an extended temperature range of -40°C to 105°C.

Key Features:

  • 2Gbit LPDDR4 SDRAM with 128M x 16 organization
  • High-speed operation at 2.133 GHz clock frequency
  • Ultra-fast 3.5 ns access time and 18 ns write cycle
  • Wide operating temperature range: -40°C to 105°C (TC)
  • Dual voltage supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
  • Compact 200-WFBGA (10x14.5mm) surface mount package
  • RoHS compliant for environmental safety
  • LVSTL_11 memory interface

Applications: Mobile devices, automotive infotainment systems, industrial control systems, medical equipment, telecommunications infrastructure, and embedded computing platforms requiring high-density, high-speed volatile memory with extended temperature tolerance.

Backed by Winbond's reputation for quality and reliability, the W66BP6NBUAHJ offers full traceability and compliance documentation (RoHS/REACH) to support your design-in requirements and production-scale sourcing needs.


Related Resources

Explore our complete range of Memory semiconductor components for your design requirements. Visit the HQICKEY homepage to browse our full catalog of high-reliability electronic components. Stay updated with the latest industry insights and product announcements on our News blog.