Winbond Electronics W66BQ2NQQAFJ TR
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 13.56 | Dhs. 13.56 |
| 15+ | Dhs. 13.13 | Dhs. 196.95 |
| 25+ | Dhs. 12.84 | Dhs. 321.00 |
| 50+ | Dhs. 12.13 | Dhs. 606.50 |
| 100+ | Dhs. 10.70 | Dhs. 1,070.00 |
| N+ | Dhs. 2.14 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tape & Reel (TR) | |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4X |
| Memory Size | 2Gbit |
| Memory Organization | 64M x 32 |
| Memory Interface | LVSTL_06 |
| Clock Frequency | 1.6 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 200-TFBGA |
| Supplier Device Package | 200-TFBGA (10x14.5) |
| ROHS |  |
Winbond W66BQ2NQQAFJ TR - High-Performance LPDDR4X Mobile DRAM
The Winbond W66BQ2NQQAFJ TR is a 2Gbit low-power DDR4X (LPDDR4X) mobile DRAM designed for high-performance mobile and embedded applications. Featuring a 1.6 GHz clock frequency and 64M x 32 memory organization, this component delivers exceptional speed and efficiency for demanding workloads.
Key Features
- High-Speed Performance: 1.6 GHz clock frequency with 3.6 ns access time
- Low Power Consumption: LPDDR4X technology optimized for mobile and battery-powered devices
- Industrial Temperature Range: Operates reliably from -40°C to 105°C (TC)
- Compact Package: 200-TFBGA (10x14.5mm) surface mount package
- RoHS Compliant: Meets environmental standards for global distribution
- Production-Ready: Tape & reel packaging for automated assembly
Applications
Ideal for automotive infotainment systems, industrial IoT devices, mobile computing platforms, embedded vision systems, and telecommunications equipment requiring high-bandwidth, low-power memory solutions.
Quality & Compliance
This component is backed by Winbond Electronics' reputation for reliability and quality. Full traceability documentation, datasheets, and technical support are available to ensure seamless design-in and production integration.
Related Resources
Explore our complete range of Memory Components for your semiconductor design needs. Visit our homepage to browse our full catalog of industrial-grade components, or check out our technical blog for the latest industry insights and application notes.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
