Winbond Electronics W66BQ6NBHAHJ
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 11.09 | Dhs. 11.09 |
| 15+ | Dhs. 10.75 | Dhs. 161.25 |
| 25+ | Dhs. 10.52 | Dhs. 263.00 |
| 50+ | Dhs. 9.94 | Dhs. 497.00 |
| 100+ | Dhs. 8.77 | Dhs. 877.00 |
| N+ | Dhs. 1.75 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tray | |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4X |
| Memory Size | 2Gbit |
| Memory Organization | 128M x 16 |
| Memory Interface | LVSTL_06 |
| Clock Frequency | 2.133 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 100-VFBGA |
| Supplier Device Package | 100-VFBGA (10x7.5) |
| ROHS |  |
The W66BQ6NBHAHJ is a high-performance 2Gbit LPDDR4X mobile DRAM memory solution from Winbond Electronics, engineered for demanding mobile and embedded applications requiring reliable, low-power memory performance.
This advanced SDRAM chip features a 128M x 16 memory organization with a 2.133 GHz clock frequency, delivering exceptional data throughput while maintaining energy efficiency. The LVSTL_06 memory interface ensures robust signal integrity, while the dual voltage supply (1.06V ~ 1.17V, 1.7V ~ 1.95V) optimizes power consumption for battery-powered devices.
Key Features & Benefits:
- 2Gbit capacity with 128M x 16 organization for flexible memory architecture
- LPDDR4X technology provides superior power efficiency for mobile platforms
- 2.133 GHz clock frequency enables high-speed data processing
- Extended operating temperature range (-40°C to 105°C) for industrial-grade reliability
- Fast access time of 3.6 ns and 18ns write cycle time for responsive performance
- Compact 100-VFBGA (10x7.5mm) surface mount package saves board space
- RoHS compliant for environmental responsibility
Technical Specifications:
Applications:
The W66BQ6NBHAHJ is ideal for smartphones, tablets, automotive infotainment systems, IoT devices, industrial controllers, and other mobile computing platforms where low power consumption, high performance, and temperature resilience are critical requirements.
Quality & Reliability:
Manufactured by Winbond Electronics with stringent quality control processes, this memory chip meets RoHS environmental standards and is designed for long-term reliability in mission-critical applications across aerospace, automotive, industrial, medical, and telecommunications sectors.
Related Products & Resources:
- Explore our complete Memory Solutions Collection for DRAM, SRAM, Flash, and specialized memory components
- Visit HQICKEY for our full range of high-reliability semiconductors
- Read our Technical Blog for application notes, design guides, and industry insights
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
