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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface LVSTL_11
Clock Frequency 1.866 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66BQ6NBUAGJ - High-Performance Mobile LPDDR4X DRAM

The W66BQ6NBUAGJ from Winbond Electronics is a 2Gbit mobile LPDDR4X SDRAM designed for high-performance mobile and embedded applications. Featuring a 128M x 16 memory organization and operating at 1.866 GHz, this component delivers exceptional speed and reliability for demanding applications in aerospace, automotive, industrial, medical, and telecommunications sectors.

Key Features & Benefits

  • High-Speed Performance: 1.866 GHz clock frequency with 3.5ns access time for rapid data processing
  • Mobile-Optimized: LPDDR4X technology ensures low power consumption for battery-powered devices
  • Wide Temperature Range: -40°C to 105°C (TC) operation for harsh industrial environments
  • Compact Footprint: 200-WFBGA (10x14.5mm) surface mount package saves board space
  • RoHS Compliant: Environmentally friendly and meets global regulatory standards
  • Full Traceability: Authorized distribution with complete documentation and datasheet support

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