• W66CP2NQQAFJ TR Winbond Electronics IC Memory DRAM 4GBIT LVSTL 200TFBGA Original Authentic IC Component
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Winbond Electronics

W66CP2NQQAFJ TR

Dhs. 14.72
Dhs. 15.51 Dhs. 14.72
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Recycling Electronic Components

Winbond W66CP2NQQAFJ TR - High-Performance Mobile LPDDR4 SDRAM Memory IC

The W66CP2NQQAFJ TR from Winbond Electronics is a high-reliability 4Gbit mobile LPDDR4 SDRAM designed for demanding applications in automotive, industrial, medical, and telecommunications sectors. Featuring a 128M x 32 memory organization and 1.6GHz clock frequency, this surface-mount memory IC delivers exceptional performance with low power consumption.

Key Features:

  • 4Gbit capacity with 128M x 32 organization
  • Mobile LPDDR4 SDRAM technology for power efficiency
  • 1.6GHz clock frequency with 3.6ns access time
  • Wide operating temperature range: -40°C to 105°C
  • 200-TFBGA package (10x14.5mm) for compact designs
  • RoHS and REACH compliant with full traceability
  • Dual voltage supply: 1.06V-1.17V and 1.7V-1.95V

Ideal for high-reliability applications requiring long lifecycle support and consistent performance across extreme temperature ranges. Available in Tape & Reel packaging for automated assembly processes.

Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 4Gbit
Memory Organization 128M x 32
Memory Interface LVSTL_11
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-TFBGA
Supplier Device Package 200-TFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.

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