Winbond Electronics W66CP2NQQAFJ TR
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | $3.93 | $3.93 |
| 15+ | $3.81 | $57.15 |
| 25+ | $3.73 | $93.25 |
| 50+ | $3.52 | $176.00 |
| 100+ | $3.11 | $311.00 |
| N+ | $0.62 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tape & Reel (TR) | |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR4 |
| Memory Size | 4Gbit |
| Memory Organization | 128M x 32 |
| Memory Interface | LVSTL_11 |
| Clock Frequency | 1.6 GHz |
| Write Cycle Time - Word, Page | 18ns |
| Access Time | 3.6 ns |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 200-TFBGA |
| Supplier Device Package | 200-TFBGA (10x14.5) |
| ROHS |
Winbond W66CP2NQQAFJ TR - High-Performance Mobile LPDDR4 SDRAM Memory IC
The W66CP2NQQAFJ TR from Winbond Electronics is a high-reliability 4Gbit mobile LPDDR4 SDRAM designed for demanding applications in automotive, industrial, medical, and telecommunications sectors. Featuring a 128M x 32 memory organization and 1.6GHz clock frequency, this surface-mount memory IC delivers exceptional performance with low power consumption.
Key Features:
- 4Gbit capacity with 128M x 32 organization
- Mobile LPDDR4 SDRAM technology for power efficiency
- 1.6GHz clock frequency with 3.6ns access time
- Wide operating temperature range: -40°C to 105°C
- 200-TFBGA package (10x14.5mm) for compact designs
- RoHS and REACH compliant with full traceability
- Dual voltage supply: 1.06V-1.17V and 1.7V-1.95V
Ideal for high-reliability applications requiring long lifecycle support and consistent performance across extreme temperature ranges. Available in Tape & Reel packaging for automated assembly processes.
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
