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Regular price $4.34
Regular price $4.57 Sale price $4.34
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15+ $4.20 $63.00
25+ $4.11 $102.75
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100+ $3.43 $343.00
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray | Tray
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 4Gbit
Memory Organization 128M x 32
Memory Interface LVSTL_11
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-TFBGA
Supplier Device Package 200-TFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66CQ2NQQAFJ - High-Performance Mobile LPDDR4X DRAM Memory

The Winbond W66CQ2NQQAFJ is a cutting-edge 4Gbit LPDDR4X mobile DRAM memory chip designed for high-performance mobile and embedded applications. Featuring a 128M x 32 organization and operating at 1.6GHz clock frequency, this memory solution delivers exceptional speed and reliability for demanding mobile computing environments.

Key Features & Benefits

  • High-Speed Performance: 1.6GHz clock frequency with 3.6ns access time ensures rapid data processing
  • Low Power Consumption: LPDDR4X technology optimized for mobile applications with dual voltage supply (1.06V-1.17V, 1.7V-1.95V)
  • Wide Temperature Range: Industrial-grade operation from -40°C to 105°C (TC) for reliable performance in harsh environments
  • Compact Surface Mount Package: 200-TFBGA (10x14.5mm) for space-constrained designs
  • RoHS Compliant: Environmentally friendly manufacturing meets global standards

Ideal Applications

Perfect for smartphones, tablets, automotive infotainment systems, IoT devices, industrial controllers, and embedded computing platforms requiring high-speed, low-power memory solutions.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.