Winbond Electronics W66CQ2NQQAGJ TR

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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 4Gbit
Memory Organization 128M x 32
Memory Interface LVSTL_11
Clock Frequency 1.867 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-TFBGA
Supplier Device Package 200-TFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W66CQ2NQQAGJ TR - High-Performance LPDDR4X Mobile DRAM

The Winbond W66CQ2NQQAGJ is a high-performance 4Gbit LPDDR4X SDRAM designed for mobile and embedded applications requiring low power consumption and high-speed data transfer. This volatile memory IC features a 128M x 32 organization with LVSTL_11 interface, operating at 1.867 GHz clock frequency with 3.6ns access time.

Key Features:

  • 4Gbit memory capacity with 128M x 32 organization
  • LPDDR4X technology for ultra-low power mobile applications
  • 1.867 GHz clock frequency with 3.6ns access time
  • Dual voltage supply: 1.06V ~ 1.17V and 1.7V ~ 1.95V
  • Extended temperature range: -40°C to 105°C (TC)
  • 200-TFBGA (10x14.5) surface mount package
  • RoHS and REACH compliant
  • Tape & Reel packaging for automated assembly

Applications: Ideal for smartphones, tablets, automotive infotainment systems, industrial controllers, medical devices, and other mobile computing platforms requiring reliable, high-speed memory with long lifecycle support.

As an authorized distributor, we provide full traceability, original manufacturer documentation, and guaranteed long-term availability for design-in confidence across aerospace, automotive, industrial, medical, and telecommunications segments.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.