XAZU2EG-1SFVA625Q
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 2,669.40 AED | Dhs. 2,669.40 AED |
| 15+ | Dhs. 2,585.09 AED | Dhs. 38,776.35 AED |
| 25+ | Dhs. 2,528.89 AED | Dhs. 63,222.25 AED |
| 50+ | Dhs. 2,388.40 AED | Dhs. 119,420.00 AED |
| 100+ | Dhs. 2,107.41 AED | Dhs. 210,741.00 AED |
| N+ | Dhs. 421.48 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG XAZU2EG-1SFVA625Q
The AMD XAZU2EG-1SFVA625Q is a high-performance, mission-critical System-on-Chip (SoC) combining programmable logic with processing power. Part of the Zynq® UltraScale+™ MPSoC EG series, this device integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 GPU alongside 103K+ FPGA logic cells.
Key Features & Benefits
- Heterogeneous Processing: Quad ARM Cortex-A53 (1.2GHz) + Dual ARM Cortex-R5 (500MHz) for real-time and application processing
- High-Density FPGA: 103K+ logic cells for custom hardware acceleration and I/O flexibility
- Integrated Memory: 1.2MB on-chip RAM for low-latency data access
- Rich Connectivity: CANbus, I²C, SPI, UART/USART, USB interfaces for versatile system integration
- Extended Temperature Range: -40°C to +125°C (TJ) for harsh-environment reliability
- Compact 625-FCBGA Package: 21x21mm footprint for space-constrained designs
- RoHS Compliant: Meets environmental and regulatory standards
Target Applications
Engineered for aerospace, automotive, industrial automation, medical devices, and telecommunications, the XAZU2EG-1SFVA625Q delivers the processing power, programmability, and reliability required for safety-critical and long-lifecycle designs.
Why Choose XAZU2EG-1SFVA625Q?
This SoC enables design engineers to consolidate multiple discrete components into a single, power-efficient device. With full traceability, authorized distribution, and long-term availability, it's the trusted choice for mission-critical embedded systems.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 1.2MB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, I2C, SPI, UART/USART, USB |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 625-BFBGA, FCBGA |
| Supplier Device Package | 625-FCBGA (21x21) |
| ROHS |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
