AMD XC2VP20-7FG676C
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,870.06 | Dhs. 355,870.06 |
| 15+ | Dhs. 344,632.06 | Dhs. 5,169,480.90 |
| 25+ | Dhs. 337,140.05 | Dhs. 8,428,501.25 |
| 50+ | Dhs. 318,410.05 | Dhs. 15,920,502.50 |
| 100+ | Dhs. 280,950.05 | Dhs. 28,095,005.00 |
| N+ | Dhs. 56,190.01 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Virtex®-II Pro |
| Packaging | | Tray |
| Number of LABs/CLBs | 2320 |
| Number of Logic Elements/Cells | 20880 |
| Total RAM Bits | 1622016 |
| Number of I/O | 404 |
| Number of Gates | - |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
AMD XC2VP20-7FG676C Virtex-II Pro FPGA - High-Reliability Field-Programmable Gate Array for Mission-Critical Applications
The AMD XC2VP20-7FG676C is a high-performance FPGA from the proven Virtex®-II Pro family, specifically engineered for demanding applications in aerospace, automotive, industrial control, medical devices, and telecommunications infrastructure. This component delivers exceptional logic density with 20,880 logic elements and 404 I/O pins in a compact 676-FBGA surface-mount package, making it ideal for complex embedded systems requiring long-term availability and full traceability.
Key Features & Technical Benefits
- High Logic Density: 2,320 LABs/CLBs with 20,880 logic elements enabling complex FPGA design implementation and parallel processing
- Extensive On-Chip Memory: 1,622,016 total RAM bits for data-intensive signal processing and buffering applications
- Flexible I/O Architecture: 404 user I/O pins supporting multiple interface standards for diverse connectivity requirements
- Industrial Temperature Range: 0°C to 85°C (TJ) junction temperature for reliable operation in harsh industrial and automotive environments
- Precision Core Voltage: 1.425V to 1.575V operating voltage ensuring stable performance and low power consumption
- Space-Efficient Package: 676-pin Fine-Pitch Ball Grid Array (FBGA) measuring 27x27mm, optimized for high-density PCB layouts
- Surface Mount Technology: SMT-compatible for automated assembly and manufacturing scalability
Target Applications & Use Cases
The XC2VP20-7FG676C is ideal for high-reliability systems requiring long lifecycle support and proven technology, including:
- Aerospace & defense avionics systems and radar signal processing
- Automotive safety-critical systems (ADAS, powertrain control)
- Industrial automation, motion control, and machine vision
- Medical imaging equipment (ultrasound, CT, MRI processing)
- Telecommunications infrastructure (base stations, routers, switches)
- Test & measurement instrumentation
Quality Assurance & Compliance
Every XC2VP20-7FG676C unit is supplied with comprehensive traceability documentation, RoHS/REACH compliance certification, and backed by our authorized distributor warranty. Original manufacturer datasheets and specifications are preserved to support your design-in process with confidence. We maintain long-term inventory commitments to ensure continuity of supply for your production lifecycle.
Why Choose Our Authorized Distribution
As an authorized AMD distributor specializing in high-reliability semiconductors, we provide genuine components with full manufacturer traceability, technical support for design-in, flexible packaging options, and global logistics capabilities. Our commitment to long lifecycle programs ensures your critical designs remain supported throughout their operational lifetime.
XC2VP20-7FG676C.pdf