AMD XC2VP30-6FG676C
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,870.06 | Dhs. 355,870.06 |
| 15+ | Dhs. 344,632.06 | Dhs. 5,169,480.90 |
| 25+ | Dhs. 337,140.05 | Dhs. 8,428,501.25 |
| 50+ | Dhs. 318,410.05 | Dhs. 15,920,502.50 |
| 100+ | Dhs. 280,950.05 | Dhs. 28,095,005.00 |
| N+ | Dhs. 56,190.01 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Virtex®-II Pro |
| Packaging | | Tray |
| Number of LABs/CLBs | 3424 |
| Number of Logic Elements/Cells | 30816 |
| Total RAM Bits | 2506752 |
| Number of I/O | 416 |
| Number of Gates | - |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
AMD XC2VP30-6FG676C Virtex-II Pro FPGA - High-Performance Programmable Logic for Mission-Critical Applications
The AMD XC2VP30-6FG676C is a high-reliability, industrial-grade FPGA from the proven Virtex-II Pro family, specifically engineered for demanding applications in aerospace avionics, medical imaging, industrial automation, telecommunications infrastructure, and automotive electronics. Featuring 30,816 logic elements, 2.5Mb embedded block RAM, and 416 user I/O pins in a compact 676-ball fine-pitch BGA package, this device delivers exceptional performance, flexibility, and integration density for complex digital system designs.
Key Features & Technical Advantages
- 30,816 Logic Elements (3,424 CLBs) - Extensive programmable logic resources for complex FPGA designs, DSP functions, and system-on-chip integration
- 416 User I/O Pins - High pin count enables extensive connectivity for multi-interface, high-bandwidth applications and system integration
- 2.5Mb (2,506,752 bits) Embedded Block RAM - On-chip memory for efficient data buffering, FIFO implementation, lookup tables, and processing acceleration
- 676-FBGA Package (27mm x 27mm) - Space-efficient, fine-pitch ball grid array for high-density PCB designs with excellent thermal performance
- Industrial Temperature Range: 0°C to +85°C (TJ) - Reliable operation across demanding environmental conditions
- 1.425V to 1.575V Core Supply Voltage - Low-power operation with stable performance characteristics
- Surface Mount Technology - Standard SMT assembly compatible for automated manufacturing
- RoHS & REACH Compliant - Meets EU environmental directives and global regulatory standards
- Long Lifecycle Commitment - Authorized distributor ensures product availability, full manufacturer traceability, and obsolescence management
Target Applications & Use Cases
The XC2VP30-6FG676C is ideal for high-reliability embedded systems requiring proven FPGA technology with long-term availability:
- Aerospace & Defense: Avionics control systems, radar signal processing, secure communications, flight data recorders
- Medical Equipment: Imaging systems (CT, MRI, ultrasound), patient monitoring, diagnostic instruments, laboratory automation
- Industrial Control: Programmable logic controllers (PLC), motion control, machine vision, robotics, process automation
- Telecommunications: Base station infrastructure, protocol conversion, network switching, signal processing
- Automotive Electronics: Advanced driver assistance systems (ADAS), infotainment, powertrain control, vehicle networking
- Test & Measurement: High-speed data acquisition, protocol analyzers, automated test equipment (ATE)
Why Choose This FPGA?
The Virtex-II Pro architecture combines high logic density with flexible I/O capabilities, making it suitable for applications requiring complex digital logic, high-speed interfaces, and deterministic performance. The industrial temperature grade ensures reliable operation in harsh environments, while the mature product lifecycle provides design stability and long-term supply confidence.
Authorized Distributor - Quality & Traceability Guaranteed
We are an authorized distributor of genuine AMD semiconductor components. Every XC2VP30-6FG676C FPGA we supply comes with:
- Full manufacturer traceability and lot code documentation
- Original AMD packaging and handling
- RoHS and REACH compliance certification
- Manufacturer datasheet and technical documentation
- Global shipping with cross-border compliance support
- Long lifecycle management and obsolescence planning assistance
Trust our expertise in high-reliability component distribution for your mission-critical designs.
XC2VP30-6FG676C.pdf