AMD XC2VP7-6FF896C

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Product attributes Property Value
Manufacturer AMD
Product Series Virtex®-II Pro
Packaging | Tray
Number of LABs/CLBs 1232
Number of Logic Elements/Cells 11088
Total RAM Bits 811008
Number of I/O 396
Number of Gates -
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 896-BBGA, FCBGA
Supplier Device Package 896-FCBGA (31x31)

AMD XC2VP7-6FF896C - Virtex-II Pro FPGA for High-Reliability Applications

The XC2VP7-6FF896C is a high-performance Field-Programmable Gate Array (FPGA) from AMD's proven Virtex®-II Pro family, specifically designed for mission-critical applications in aerospace, defense, industrial automation, telecommunications, and medical devices where long lifecycle support and exceptional reliability are non-negotiable.

Why Choose the XC2VP7-6FF896C?

  • 11,088 Logic Elements - Extensive programmable logic resources enabling complex digital designs and signal processing algorithms
  • 396 I/O Pins - High pin-count 896-FCBGA package (31x31mm) delivers maximum connectivity for multi-interface systems
  • 811,008 RAM Bits - Integrated block RAM provides on-chip data buffering, FIFO implementation, and high-speed processing
  • Industrial Temperature Range - Qualified for 0°C to 85°C junction temperature operation in harsh environments
  • Surface Mount Technology - 896-BBGA/FCBGA package optimized for automated assembly and high-density board layouts
  • 1.5V Core Supply - Low-power operation (1.425V ~ 1.575V) reduces thermal management requirements
  • Full Traceability - Authorized distribution with complete manufacturer documentation and lifecycle support
  • RoHS/REACH Compliant - Meets global environmental and regulatory standards for conflict-free sourcing

Target Applications

Engineered for high-reliability designs in medical imaging equipment, avionics flight control systems, military/defense communications, industrial process control, digital signal processing, software-defined radio, and telecom infrastructure where long-term product availability, design-in support, and proven field performance are critical success factors.

All specifications are maintained per original manufacturer datasheet. Contact us for current lifecycle status, lead times, volume pricing, and technical design-in support.