AMD XC3S1000-4FG456I

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AMD Spartan-3 FPGA XC3S1000-4FG456I - High-Density Programmable Logic

The XC3S1000-4FG456I is a high-performance FPGA from AMD's proven Spartan®-3 family, delivering 1 million system gates in a compact 456-pin FBGA package. Ideal for aerospace, automotive, industrial control, and telecommunications applications requiring reliable programmable logic with extended temperature range operation.

Key Features & Benefits

  • 1M System Gates - Ample logic resources for complex digital designs and signal processing
  • 333 User I/O Pins - Extensive connectivity for high-bandwidth interfaces and multi-protocol support
  • 442 Kbit Embedded RAM - On-chip memory for buffering, FIFOs, and data storage
  • Industrial Temperature Range - Qualified for -40°C to +100°C (TJ) operation in harsh environments
  • Low Power Consumption - 1.14V to 1.26V core voltage for energy-efficient designs
  • Compact 456-FBGA Package - 23mm × 23mm footprint optimized for space-constrained PCB layouts

Applications

This FPGA is well-suited for embedded control, motor drive systems, industrial automation, avionics, military/defense systems, medical instrumentation, and high-reliability telecommunications infrastructure.

Authorized Distribution & Support

We supply authorized AMD stock with full manufacturer traceability, certificates of conformance, and access to official datasheets and reference designs. Every unit is sourced through authorized channels to ensure authenticity and long lifecycle support for your critical programs.

For technical documentation, reference designs, and design-in support, please contact our applications engineering team.

Product attributes Property Value
Manufacturer AMD
Product Series Spartan®-3
Packaging Tray | Tray
Number of LABs/CLBs 1920
Number of Logic Elements/Cells 17280
Total RAM Bits 442368
Number of I/O 333
Number of Gates 1000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)