XC3S1600E-4FGG400C

AMD Spartan-3E FPGA - XC3S1600E-4FGG400C

The XC3S1600E-4FGG400C is a high-density field-programmable gate array (FPGA) from AMD's proven Spartan-3E family, engineered for demanding aerospace, automotive, industrial, and telecommunications applications. With 1.6 million system gates, 304 I/O pins, and 663Kb of embedded RAM, this FPGA delivers exceptional performance and flexibility for complex digital designs.

Key Features & Benefits

• High Logic Density: 33,192 logic cells across 3,688 CLBs provide ample resources for sophisticated designs
• Extensive I/O Capability: 304 user I/O pins support diverse interface requirements
• Generous Memory: 663,552 total RAM bits enable efficient data buffering and processing
• Industrial Temperature Range: Qualified for 0°C to 85°C operation (junction temperature)
• Compact 400-FBGA Package: 21mm x 21mm footprint optimizes board space utilization
• Surface Mount Technology: Facilitates automated assembly and production scaling

Applications

Ideal for high-speed data acquisition, digital signal processing, embedded control systems, communications infrastructure, test and measurement equipment, and industrial automation. The Spartan-3E architecture balances cost-effectiveness with performance, making it suitable for both prototyping and volume production.

Quality & Authenticity

Sourced from authorized distributors with full manufacturer documentation and traceability. Each device is backed by AMD's long lifecycle commitment, ensuring availability for mission-critical designs.

Technical Specifications

Product attributes	Property Value
Manufacturer	AMD
Product Series	Spartan®-3E
Packaging	Tray | Tray
Number of LABs/CLBs	3688
Number of Logic Elements/Cells	33192
Total RAM Bits	663552
Number of I/O	304
Number of Gates	1600000
Voltage - Supply	1.14V ~ 1.26V
Mounting Type	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)
Grade	-
Qualification	-
Package / Case	400-BGA
Supplier Device Package	400-FBGA (21x21)
ROHS