AMD XC3S1600E-5FGG400C

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AMD Spartan-3E FPGA - XC3S1600E-5FGG400C

The XC3S1600E-5FGG400C is a high-density FPGA from AMD's proven Spartan-3E family, delivering 1.6 million system gates with 304 I/O in a compact 400-pin fine-pitch BGA package. Engineered for aerospace, automotive, industrial control, and telecommunications applications requiring long-term availability and proven reliability.

Key Features

  • High Logic Density: 33,192 logic cells across 3,688 CLBs for complex digital designs
  • Substantial Memory: 663,552 total RAM bits for embedded data buffering and processing
  • Flexible I/O: 304 user I/O pins supporting multiple voltage standards
  • Industrial Temperature Range: 0°C to 85°C junction temperature operation
  • Compact Footprint: 400-FBGA (21x21mm) surface-mount package
  • RoHS Compliant: Lead-free, environmentally responsible manufacturing

Applications

Ideal for high-speed data acquisition, motor control, communications protocol bridging, embedded vision processing, and safety-critical systems requiring field-proven FPGA technology with extended lifecycle support.

Sourcing Assurance

All units ship with full manufacturer documentation, lot traceability, and authorized distributor certification. Standard tray packaging ensures compatibility with automated pick-and-place assembly workflows.

Product attributes Property Value
Manufacturer AMD
Product Series Spartan®-3E
Packaging Tray | Tray
Number of LABs/CLBs 3688
Number of Logic Elements/Cells 33192
Total RAM Bits 663552
Number of I/O 304
Number of Gates 1600000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 400-BGA
Supplier Device Package 400-FBGA (21x21)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY