AMD XC3S2000-4FGG676I

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AMD Spartan-3 XC3S2000-4FGG676I FPGA - Industrial Grade

The XC3S2000-4FGG676I is a high-performance FPGA from AMD's proven Spartan-3 family, delivering 2 million system gates in a compact 676-ball fine-pitch BGA package. Designed for demanding industrial, automotive, aerospace, and telecommunications applications requiring extended temperature operation and long lifecycle availability.

Key Features & Benefits

  • High Logic Density: 5,120 CLBs with 46,080 logic cells for complex digital designs
  • Extensive I/O: 489 user I/O pins supporting multiple standards for flexible system integration
  • On-Chip Memory: 737,280 bits of distributed and block RAM for data buffering and processing
  • Industrial Temperature Range: -40°C to +100°C junction temperature for harsh environments
  • Compact Footprint: 676-FBGA (27mm × 27mm) surface-mount package optimizes board space
  • Authorized Stock: Full manufacturer documentation, traceability, and warranty support

Ideal Applications

Perfect for aerospace avionics, automotive control systems, industrial automation, telecommunications infrastructure, medical devices, and defense systems requiring proven reliability and long-term availability.

Documentation & Support: Full AMD datasheets, reference designs, and technical resources available. Contact our design-in support team for application assistance and long-term availability commitments.

Product attributes Property Value
Manufacturer AMD
Product Series Spartan®-3
Packaging Tray | Tray
Number of LABs/CLBs 5120
Number of Logic Elements/Cells 46080
Total RAM Bits 737280
Number of I/O 489
Number of Gates 2000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
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