AMD XC3S2000-5FGG676C

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AMD Spartan-3 FPGA XC3S2000-5FGG676C - High-Density Programmable Logic

The XC3S2000-5FGG676C is a high-performance field-programmable gate array (FPGA) from AMD's proven Spartan-3 family, delivering 2 million system gates and 46,080 logic cells in a compact 676-ball fine-pitch BGA package. Ideal for aerospace, industrial control, telecommunications, and embedded systems requiring reliable, cost-effective programmable logic with extensive I/O capability.

Key Features & Benefits

  • High Logic Density: 5,120 CLBs with 46,080 logic elements for complex digital designs
  • Generous Memory: 737,280 total RAM bits for embedded data buffering and processing
  • Extensive I/O: 489 user I/O pins supporting multiple standards and high-speed interfaces
  • Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation in demanding environments
  • Low Power Supply: 1.14V to 1.26V core voltage for energy-efficient designs
  • Surface Mount Package: 676-FBGA (27x27mm) optimized for automated assembly

Applications

This FPGA is well-suited for digital signal processing, protocol bridging, motor control, sensor interfacing, embedded vision systems, and custom logic acceleration in aerospace, automotive, and industrial markets.

Authorized Distributor - Full Traceability

We supply genuine AMD components with complete manufacturer documentation, certificates of conformance, and supply chain traceability to support your design-in requirements and long lifecycle programs.

Product attributes Property Value
Manufacturer AMD
Product Series Spartan®-3
Packaging Tray | Tray
Number of LABs/CLBs 5120
Number of Logic Elements/Cells 46080
Total RAM Bits 737280
Number of I/O 489
Number of Gates 2000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
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