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XC3S5000-4FG900I

XC3S5000-4FG900I

Regular price Dhs. 1,846.16
Regular price Dhs. 1,943.30 Sale price Dhs. 1,846.16
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AMD Spartan-3 XC3S5000-4FG900I FPGA - High-Density Industrial Solution

The XC3S5000-4FG900I represents AMD's flagship Spartan-3 FPGA, delivering exceptional performance for aerospace, automotive, industrial control, and telecommunications applications. This industrial-grade device features 5 million gates, 633 I/O pins, and operates reliably across the extended temperature range of -40°C to 100°C.

Key Features & Benefits

  • High Logic Density: 74,880 logic elements across 8,320 CLBs for complex design implementation
  • Extensive I/O Capability: 633 user I/O pins in compact 900-FBGA (31x31mm) package
  • Generous Memory Resources: 1,916,928 total RAM bits for data buffering and processing
  • Industrial Temperature Range: Qualified for -40°C to 100°C operation (TJ)
  • Reliable Power Supply: 1.14V to 1.26V core voltage for stable operation
  • Surface Mount Technology: 900-BBGA package for automated assembly

Applications

Ideal for high-reliability systems requiring extensive logic resources: aerospace flight control, automotive ADAS, industrial automation controllers, telecommunications infrastructure, medical imaging equipment, and defense systems.

Quality & Authenticity Guarantee

Sourced from authorized AMD distributors with full manufacturer documentation, traceability certificates, and long lifecycle support. Each device ships in bulk packaging with anti-static protection.

Technical Specifications

Product attributes Property Value
Manufacturer AMD
Product Series Spartan®-3
Packaging Bulk | Bulk
Number of LABs/CLBs 8320
Number of Logic Elements/Cells 74880
Total RAM Bits 1916928
Number of I/O 633
Number of Gates 5000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31x31)

Datasheets:     PDF icon XC3S5000-4FG900I.pdf

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