AMD XC3S5000-5FG900C

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AMD Spartan-3 FPGA XC3S5000-5FG900C - High-Density Programmable Logic Solution

The XC3S5000-5FG900C represents AMD's flagship Spartan-3 FPGA, delivering exceptional logic density and I/O capability for demanding aerospace, automotive, industrial, and telecommunications applications. This authentic, authorized distributor stock ensures full manufacturer traceability and documentation.

Key Features & Benefits

  • Massive Logic Capacity: 5 million system gates with 74,880 logic cells across 8,320 CLBs
  • Extensive I/O: 633 user I/O pins in compact 900-FBGA (31x31mm) package
  • Generous Memory: 1,916,928 total RAM bits for complex data buffering and processing
  • Industrial Temperature Range: Qualified for 0°C to 85°C (TJ) operation
  • Proven Reliability: AMD Spartan-3 architecture with long lifecycle commitment
  • Design Flexibility: Surface mount 900-BBGA package optimized for high-density PCB layouts

Applications

Ideal for high-performance embedded systems, signal processing, communications infrastructure, industrial automation, and aerospace/defense applications requiring extensive logic resources and I/O connectivity.

Quality Assurance

All units sourced from authorized AMD distributors with full manufacturer documentation, traceability, and long-term availability commitment. Packaged in standard bulk trays for integration with existing supply chain workflows.

Product attributes Property Value
Manufacturer AMD
Product Series Spartan®-3
Packaging Bulk | Bulk
Number of LABs/CLBs 8320
Number of Logic Elements/Cells 74880
Total RAM Bits 1916928
Number of I/O 633
Number of Gates 5000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31x31)