AMD XC3SD3400A-4FGG676C

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AMD XC3SD3400A-4FGG676C - Spartan-3A DSP FPGA

The XC3SD3400A-4FGG676C is a high-performance FPGA from AMD's Spartan®-3A DSP family, delivering 3.4 million gates and 53,712 logic elements in a compact 676-FBGA package. Designed for demanding applications in aerospace, automotive, industrial control, and telecommunications, this device combines exceptional logic density with integrated DSP capabilities.

Key Features & Benefits

  • High Logic Density: 5,968 CLBs with 53,712 logic cells for complex digital designs
  • Extensive I/O: 469 user I/O pins for flexible system integration
  • Embedded Memory: 2,322,432 total RAM bits for data buffering and processing
  • Industrial Temperature Range: 0°C to 85°C (TJ) operation for reliable performance
  • Low Power Supply: 1.14V ~ 1.26V core voltage for energy-efficient operation
  • Surface Mount Package: 676-FBGA (27x27mm) for high-density PCB layouts

Applications

Ideal for digital signal processing, embedded systems, communications infrastructure, industrial automation, test & measurement equipment, and aerospace/defense systems requiring high-performance programmable logic.

Authorized Distributor - Full Traceability

We supply genuine AMD/Xilinx components with complete manufacturer documentation, authenticity guarantees, and full supply chain traceability. All units are sourced through authorized channels with long lifecycle support to protect your design investment.

Product attributes Property Value
Manufacturer AMD
Product Series Spartan®-3A DSP
Packaging Tray | Tray
Number of LABs/CLBs 5968
Number of Logic Elements/Cells 53712
Total RAM Bits 2322432
Number of I/O 469
Number of Gates 3400000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
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