AMD XC4052XL-3BG560I

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AMD XC4052XL-3BG560I Field-Programmable Gate Array

The XC4052XL-3BG560I is a high-density FPGA from AMD's proven XC4000E/X series, engineered for demanding aerospace, automotive, industrial, and telecommunications applications requiring reliable performance across extended temperature ranges.

Key Features

  • 52,000 gates with 1,936 configurable logic blocks (CLBs) for complex digital designs
  • 352 I/O pins in a compact 560-MBGA (42.5×42.5mm) package
  • Industrial temperature grade: -40°C to +100°C (TJ)
  • 61,952 total RAM bits for embedded memory applications
  • Surface mount technology for automated assembly
  • 3V to 3.6V supply voltage for low-power operation

Applications

Ideal for high-reliability systems including avionics, automotive control units, industrial automation, telecommunications infrastructure, and mission-critical embedded systems requiring long lifecycle support.

Authenticity Guaranteed

All units sourced from authorized distributors with full manufacturer documentation, certificates of conformance, and complete traceability. We specialize in long-lifecycle FPGA solutions with engineering support for design-in assistance.

Product attributes Property Value
Manufacturer AMD
Product Series XC4000E/X
Packaging Tray | Tray
Number of LABs/CLBs 1936
Number of Logic Elements/Cells 4598
Total RAM Bits 61952
Number of I/O 352
Number of Gates 52000
Voltage - Supply 3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 560-LBGA Exposed Pad, Metal
Supplier Device Package 560-MBGA (42.5x42.5)