AMD XC7Z030-2FBG676E

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AMD Zynq-7000 SoC - XC7Z030-2FBG676E

The XC7Z030-2FBG676E is a high-performance System-on-Chip (SoC) combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric, delivering exceptional processing power and programmable logic for mission-critical applications in aerospace, automotive, industrial automation, and telecommunications infrastructure.

Key Features

  • Dual ARM Cortex-A9 MPCore with CoreSight debug technology running at 800MHz
  • Kintex-7 FPGA fabric with 125,000 logic cells for flexible hardware acceleration
  • 256KB on-chip RAM for high-speed data processing
  • Comprehensive connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, MMC/SD/SDIO
  • Industrial temperature range: 0°C to 100°C (TJ) for reliable operation in harsh environments
  • 676-FCBGA package (27x27mm) optimized for space-constrained designs
  • RoHS compliant for environmental compliance

Applications

Ideal for embedded vision systems, motor control, software-defined radio, industrial networking, avionics, and high-performance computing applications requiring both processing power and FPGA flexibility.

Documentation & Support

Full technical documentation, datasheets, and design resources are available. This component is backed by AMD's long-term availability commitment and comprehensive technical support for production designs.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY