AMD XC7Z030-2FF676I

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AMD XC7Z030-2FF676I Zynq-7000 SoC – Dual ARM Cortex-A9 with Kintex-7 FPGA

High-Performance System-on-Chip for Industrial, Aerospace & Automotive Applications

The AMD XC7Z030-2FF676I is an industrial-grade System-on-Chip (SoC) from the proven Zynq-7000 family, integrating dual ARM Cortex-A9 MPCore processors running at 800MHz with CoreSight debug technology and a powerful Kintex-7 FPGA fabric featuring 125,000 logic cells. This architecture delivers the flexibility of programmable logic combined with the performance of embedded processors in a single, compact device.

With 256KB on-chip RAM and comprehensive connectivity including Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, and MMC/SD/SDIO, the XC7Z030 enables rapid development of complex embedded systems. The industrial temperature range of -40°C to 100°C (TJ) ensures reliable operation in the harshest environments, from factory floors to aerospace applications.

Key Technical Features

  • Dual ARM Cortex-A9 MPCore processors with CoreSight debug at 800MHz for high-performance embedded processing
  • Kintex-7 FPGA fabric with 125,000 logic cells for custom hardware acceleration and real-time signal processing
  • 256KB on-chip RAM for fast data buffering and processing
  • DMA peripherals for efficient, low-latency data transfer between processor and FPGA
  • Comprehensive connectivity: Ethernet MAC, USB 2.0 OTG, dual CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO interfaces
  • Industrial temperature grade: -40°C to 100°C (TJ) for extreme environment reliability
  • Active production status with long-term availability commitment from AMD
  • Compact 676-FCBGA package (27x27mm) for space-constrained designs
  • RoHS compliant with full traceability and authentic AMD quality

Target Applications

The XC7Z030-2FF676I is engineered for demanding embedded applications across multiple industries:

  • Industrial Automation: Motor control, machine vision, robotics, PLC systems, industrial IoT gateways
  • Automotive: Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment, sensor fusion, automotive Ethernet
  • Aerospace & Defense: Avionics systems, radar processing, secure communications, flight control
  • Medical Devices: Ultrasound imaging, patient monitoring, diagnostic equipment
  • Communications: Software-defined radio (SDR), base station processing, protocol conversion
  • Test & Measurement: High-speed data acquisition, signal analysis, automated test equipment

Why Choose the XC7Z030-2FF676I?

This SoC combines the best of both worlds: the software programmability of ARM processors with the hardware acceleration capabilities of FPGA logic. Design engineers can partition compute-intensive tasks to the FPGA fabric while running operating systems like Linux or real-time OS on the ARM cores. The result is lower power consumption, reduced latency, and higher system performance compared to traditional CPU+FPGA architectures.

AMD provides comprehensive development tools including Vivado Design Suite and Vitis unified software platform, along with extensive reference designs and IP cores to accelerate your time-to-market.

Documentation & Support

Full technical documentation available: Datasheets, reference manuals, application notes, reference designs, and development board schematics from AMD. RoHS compliant. Authentic AMD product with complete supply chain traceability and quality assurance.

Ordering Information

Part Number: XC7Z030-2FF676I
Availability: Active production, in stock
Package: 676-FCBGA (27x27mm)
Temperature Grade: Industrial (-40°C to 100°C)

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)