AMD XC7Z030-L2FBG676I

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AMD Zynq-7000 SoC: XC7Z030-L2FBG676I

The XC7Z030-L2FBG676I is a high-performance System-on-Chip (SoC) from AMD's Zynq®-7000 family, combining dual ARM® Cortex®-A9 MPCore™ processing power with Kintex™-7 FPGA fabric. Engineered for demanding applications in aerospace, automotive, industrial automation, and telecom infrastructure.

Key Features

  • Dual-core ARM Cortex-A9 MPCore™ with CoreSight™ debug technology running at 800MHz
  • Kintex-7 FPGA fabric with 125,000 logic cells for custom hardware acceleration
  • 256KB on-chip RAM for high-speed data processing
  • Industrial temperature range: -40°C to 100°C (TJ) for harsh environments
  • Rich connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • 676-FCBGA package (27x27mm) for space-efficient designs
  • RoHS compliant for environmental standards

Applications

Ideal for embedded vision systems, motor control, industrial networking, software-defined radio, and real-time signal processing applications requiring both processing power and FPGA flexibility.

Documentation & Support

Full datasheets, reference designs, and technical documentation available. Long-term availability guaranteed for production planning.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY