AMD XC7Z035-1FBG676I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 5,071.81 | Dhs. 5,071.81 |
| 15+ | Dhs. 4,911.65 | Dhs. 73,674.75 |
| 25+ | Dhs. 4,804.88 | Dhs. 120,122.00 |
| 50+ | Dhs. 4,537.94 | Dhs. 226,897.00 |
| 100+ | Dhs. 4,004.06 | Dhs. 400,406.00 |
| N+ | Dhs. 800.81 | Price Inquiry |
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AMD Zynq-7000 SoC: XC7Z035-1FBG676I
The XC7Z035-1FBG676I is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining the software programmability of a dual ARM Cortex-A9 MPCore processor with the hardware flexibility of Kintex-7 FPGA fabric. This industrial-grade device delivers 667MHz processing speed with 275K logic cells, making it ideal for aerospace, automotive, industrial automation, and telecom infrastructure applications.
Key Features & Benefits
- Dual-core ARM Cortex-A9 MPCore with CoreSight - High-performance processing with advanced debug capabilities
- Kintex-7 FPGA with 275K logic cells - Extensive programmable logic for custom acceleration
- 256KB integrated RAM - On-chip memory for fast data access
- Rich connectivity options - CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
- Industrial temperature range - Operates reliably from -40°C to 100°C (TJ)
- RoHS compliant - Meets environmental standards for global deployment
- Active part status - Long-term availability for mission-critical designs
Applications
This SoC is engineered for demanding embedded applications requiring both processing power and FPGA flexibility, including motor control systems, industrial vision processing, software-defined radio, advanced driver assistance systems (ADAS), and high-speed data acquisition platforms.
Documentation & Support
Full technical documentation, reference designs, and development tools are available from AMD to accelerate your design cycle and ensure reliable implementation.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |  |
XC7Z035-1FBG676I.pdf