AMD XC7Z035-2FFG676I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 7,611.27 | Dhs. 7,611.27 |
| 15+ | Dhs. 7,370.92 | Dhs. 110,563.80 |
| 25+ | Dhs. 7,210.68 | Dhs. 180,267.00 |
| 50+ | Dhs. 6,810.09 | Dhs. 340,504.50 |
| 100+ | Dhs. 6,008.90 | Dhs. 600,890.00 |
| N+ | Dhs. 1,201.78 | Price Inquiry |
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AMD XC7Z035-2FFG676I Zynq-7000 SoC FPGA
The XC7Z035-2FFG676I is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This industrial-grade device delivers exceptional processing power and programmable logic capabilities for mission-critical applications in aerospace, automotive, industrial automation, medical equipment, and telecommunications.
Key Features & Benefits
- Dual-Core Processing: Dual ARM Cortex-A9 MPCore with CoreSight running at 800MHz for high-performance embedded processing
- Programmable Logic: Kintex-7 FPGA with 275K logic cells for flexible hardware acceleration and custom I/O interfaces
- Rich Connectivity: Integrated CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environment deployment
- Compact Package: 676-FCBGA (27x27mm) for space-constrained designs
- RoHS Compliant: Meets environmental standards for global markets
Ideal Applications
Perfect for aerospace flight control systems, automotive ADAS and infotainment, industrial motor control and machine vision, medical imaging equipment, 5G/telecommunications infrastructure, and defense systems requiring long lifecycle support.
Why Choose This Component
As an authorized distributor, we provide 100% authentic AMD components with full traceability, comprehensive datasheets, and long-term availability commitments. Every unit is sourced directly from AMD or authorized channels, ensuring reliability for your critical designs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |  |
XC7Z035-2FFG676I.pdf