AMD XC7Z035-2FFV676E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,874.90 | Dhs. 355,874.90 |
| 15+ | Dhs. 344,636.75 | Dhs. 5,169,551.25 |
| 25+ | Dhs. 337,144.64 | Dhs. 8,428,616.00 |
| 50+ | Dhs. 318,414.39 | Dhs. 15,920,719.50 |
| 100+ | Dhs. 280,953.87 | Dhs. 28,095,387.00 |
| N+ | Dhs. 56,190.77 | Price Inquiry |
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AMD Zynq-7000 XC7Z035-2FFV676E System-on-Chip
The XC7Z035-2FFV676E is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining the processing power of a dual-core ARM Cortex-A9 MPCore processor with the flexibility of Kintex-7 FPGA technology. This powerful combination delivers exceptional performance for demanding applications in aerospace, automotive, industrial automation, telecommunications, and medical equipment.
Key Features & Benefits
- Dual ARM Cortex-A9 MPCore with CoreSight: 800MHz processing power for real-time control and embedded applications
- Kintex-7 FPGA Integration: 275,000 logic cells for custom hardware acceleration and parallel processing
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- 256KB On-Chip RAM: High-speed memory for critical operations
- DMA Support: Efficient data transfer with minimal CPU overhead
- Industrial Temperature Range: 0°C to 100°C (TJ) for reliable operation in harsh environments
- Compact 676-FCBGA Package: 27x27mm footprint for space-constrained designs
- RoHS Compliant: Environmentally friendly manufacturing
Ideal Applications
This versatile SoC is perfect for applications requiring both processing power and FPGA flexibility, including motor control systems, industrial automation controllers, medical imaging equipment, telecommunications infrastructure, automotive ADAS systems, and aerospace avionics.
Note: This part is marked as obsolete. Please contact us for availability, alternative solutions, or last-time-buy opportunities.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | | |
| Part Status | Obsolete |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |  |
XC7Z035-2FFV676E.pdf