AMD
XC7Z035-3FFG900E
XC7Z035-3FFG900E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 10,062.55 AED | Dhs. 10,062.55 AED |
| 15+ | Dhs. 9,744.77 AED | Dhs. 146,171.55 AED |
| 25+ | Dhs. 9,532.93 AED | Dhs. 238,323.25 AED |
| 50+ | Dhs. 9,003.32 AED | Dhs. 450,166.00 AED |
| 100+ | Dhs. 7,944.11 AED | Dhs. 794,411.00 AED |
| N+ | Dhs. 1,588.82 AED | Price Inquiry |
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AMD Zynq-7000 SoC - XC7Z035-3FFG900E
The XC7Z035-3FFG900E is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This powerful device delivers 1GHz processing speed with 275K logic cells, making it ideal for embedded systems requiring both processing power and programmable logic.
Key Features:
- Dual ARM Cortex-A9 MPCore with CoreSight at 1GHz
- Kintex-7 FPGA with 275,000 logic cells
- 256KB integrated RAM
- Comprehensive connectivity: Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART
- Industrial temperature range: 0°C to 100°C (TJ)
- 900-FCBGA (31x31mm) package
Applications: Industrial automation, embedded vision systems, motor control, communications infrastructure, aerospace and defense systems.
All products are 100% genuine AMD components with full traceability and compliance documentation.
Technical Specifications
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | Tray |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1GHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
Datasheets:
XC7Z035-3FFG900E
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