AMD XC7Z045-2FBG676E

Skip to product information
1 of 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Regular price Dhs. 7,068.58
Regular price Dhs. 7,440.60 Sale price Dhs. 7,068.58
Sale Sold out
Quantity Unit Price Total Price
1 Dhs. 7,068.58 Dhs. 7,068.58
15+ Dhs. 6,845.35 Dhs. 102,680.25
25+ Dhs. 6,696.54 Dhs. 167,413.50
50+ Dhs. 6,324.51 Dhs. 316,225.50
100+ Dhs. 5,580.45 Dhs. 558,045.00
N+ Dhs. 1,116.09 Price Inquiry
Shipping calculated at checkout.
Quantity
Component Recycling

Request Quote / Inquiry

AMD Zynq-7000 XC7Z045-2FBG676E SoC FPGA

The XC7Z045-2FBG676E is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This powerful integration delivers 800MHz processing speed with 350K logic cells, making it ideal for aerospace, automotive, industrial automation, and telecom infrastructure applications.

Key Features

  • Dual ARM Cortex-A9 MPCore with CoreSight debug and trace
  • Kintex-7 FPGA fabric with 350,000 logic cells
  • 256KB on-chip RAM for high-speed data processing
  • 800MHz processing speed for demanding real-time applications
  • Comprehensive connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • DMA peripherals for efficient data transfer
  • Industrial temperature range: 0°C to 100°C (TJ)
  • 676-FCBGA package (27x27mm) for compact integration
  • RoHS compliant for environmental standards

Applications

This SoC is engineered for mission-critical systems requiring both processing power and FPGA flexibility, including embedded vision, motor control, software-defined radio, industrial networking, and advanced driver assistance systems (ADAS).

Documentation: Full datasheets and technical reference manuals are available from AMD.

Long-term availability: Active production status ensures reliable supply for multi-year design cycles.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY