AMD XC7Z045-3FFG676E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 10,605.07 | Dhs. 10,605.07 |
| 15+ | Dhs. 10,270.17 | Dhs. 154,052.55 |
| 25+ | Dhs. 10,046.91 | Dhs. 251,172.75 |
| 50+ | Dhs. 9,488.75 | Dhs. 474,437.50 |
| 100+ | Dhs. 8,372.42 | Dhs. 837,242.00 |
| N+ | Dhs. 1,674.48 | Price Inquiry |
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AMD Zynq-7000 SoC FPGA - XC7Z045-3FFG676E
The XC7Z045-3FFG676E is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, combining dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This powerful integration delivers exceptional processing capability and programmable logic flexibility for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Dual ARM Cortex-A9 MPCore with CoreSight: 1GHz processing power for demanding embedded applications
- Kintex-7 FPGA Fabric: 350K logic cells for custom hardware acceleration and I/O flexibility
- 256KB On-Chip RAM: High-speed memory for real-time processing
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI interfaces
- Industrial Temperature Range: 0°C to 100°C (TJ) for harsh environments
- Compact 676-FCBGA Package: 27x27mm footprint for space-constrained designs
- RoHS Compliant: Meets environmental standards for global markets
Applications
Ideal for advanced driver assistance systems (ADAS), industrial machine vision, software-defined radio, medical imaging equipment, test & measurement instruments, and high-performance embedded computing platforms requiring both processing power and FPGA programmability.
Why Choose Our Components
As an authorized distributor, we guarantee 100% authentic AMD components with full traceability, comprehensive datasheets, and long lifecycle availability. Our technical team provides design-in support to help you accelerate time-to-market for your critical applications.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq®-7000 |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1GHz |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| ROHS |  |
XC7Z045-3FFG676E.pdf