AMD XC7Z100-2FF900I

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AMD XC7Z100-2FF900I Zynq-7000 SoC FPGA

The XC7Z100-2FF900I is a high-performance System-on-Chip (SoC) from AMD's Zynq-7000 family, integrating a dual-core ARM Cortex-A9 MPCore processor with CoreSight running at 800MHz alongside a powerful Kintex-7 FPGA fabric with 444K logic cells. This industrial-grade device operates reliably across extended temperature ranges from -40°C to 100°C, making it ideal for demanding aerospace, automotive, industrial automation, medical equipment, and telecommunications applications.

Key Features & Benefits

  • Dual ARM Cortex-A9 MPCore with CoreSight: High-performance processing with advanced debug capabilities
  • Kintex-7 FPGA (444K Logic Cells): Extensive programmable logic for custom acceleration and I/O interfaces
  • 256KB On-Chip RAM: Fast memory for real-time processing tasks
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO support
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
  • 900-FCBGA Package: Compact 31x31mm form factor with excellent thermal performance

Typical Applications

  • Industrial automation and motor control systems
  • Aerospace and defense embedded systems
  • Medical imaging and diagnostic equipment
  • Automotive ADAS and infotainment platforms
  • High-speed data acquisition and processing
  • Telecommunications infrastructure equipment

Quality & Compliance

All units are sourced directly from authorized channels with full traceability. RoHS and REACH compliant. Long lifecycle commitment ensures availability for design-in projects requiring extended product support.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq®-7000
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)