AMD XCV200-5FG456C
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,870.06 | Dhs. 355,870.06 |
| 15+ | Dhs. 344,632.06 | Dhs. 5,169,480.90 |
| 25+ | Dhs. 337,140.05 | Dhs. 8,428,501.25 |
| 50+ | Dhs. 318,410.05 | Dhs. 15,920,502.50 |
| 100+ | Dhs. 280,950.05 | Dhs. 28,095,005.00 |
| N+ | Dhs. 56,190.01 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Virtex® |
| Packaging | | Tray |
| Number of LABs/CLBs | 1176 |
| Number of Logic Elements/Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of I/O | 284 |
| Number of Gates | 236666 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 456-BBGA |
| Supplier Device Package | 456-FBGA (23x23) |
AMD Virtex® XCV200-5FG456C FPGA - High-Performance Programmable Logic Solution
The XCV200-5FG456C from AMD's renowned Virtex® series delivers exceptional programmable logic performance for mission-critical embedded systems. This field-programmable gate array (FPGA) features 236,666 gates, 5,292 logic elements, and 284 I/O pins in a compact 456-FBGA package, making it ideal for aerospace, industrial automation, telecommunications, and high-reliability applications.
Key Features & Benefits
- High Logic Density: 1,176 CLBs with 5,292 logic elements provide extensive design flexibility
- Generous Memory: 57,344 total RAM bits for complex data processing and buffering
- Extensive I/O Capability: 284 configurable I/O pins for versatile system integration
- Industrial-Grade Reliability: Operating temperature range of 0°C to 85°C (TJ) ensures stable performance in demanding environments
- Optimized Power Supply: 2.375V to 2.625V supply voltage for efficient power management
- Surface Mount Design: 456-BBGA package (23x23mm) for space-efficient PCB layouts
Applications
This FPGA is engineered for high-speed digital signal processing, protocol conversion, embedded control systems, and custom logic implementation in aerospace, defense, medical devices, and telecommunications infrastructure.
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XCV200-5FG456C.pdf