AMD XCV200-5FG456C

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Product attributes Property Value
Manufacturer AMD
Product Series Virtex®
Packaging | Tray
Number of LABs/CLBs 1176
Number of Logic Elements/Cells 5292
Total RAM Bits 57344
Number of I/O 284
Number of Gates 236666
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)

AMD Virtex® XCV200-5FG456C FPGA - High-Performance Programmable Logic Solution

The XCV200-5FG456C from AMD's renowned Virtex® series delivers exceptional programmable logic performance for mission-critical embedded systems. This field-programmable gate array (FPGA) features 236,666 gates, 5,292 logic elements, and 284 I/O pins in a compact 456-FBGA package, making it ideal for aerospace, industrial automation, telecommunications, and high-reliability applications.

Key Features & Benefits

  • High Logic Density: 1,176 CLBs with 5,292 logic elements provide extensive design flexibility
  • Generous Memory: 57,344 total RAM bits for complex data processing and buffering
  • Extensive I/O Capability: 284 configurable I/O pins for versatile system integration
  • Industrial-Grade Reliability: Operating temperature range of 0°C to 85°C (TJ) ensures stable performance in demanding environments
  • Optimized Power Supply: 2.375V to 2.625V supply voltage for efficient power management
  • Surface Mount Design: 456-BBGA package (23x23mm) for space-efficient PCB layouts

Applications

This FPGA is engineered for high-speed digital signal processing, protocol conversion, embedded control systems, and custom logic implementation in aerospace, defense, medical devices, and telecommunications infrastructure.

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