AMD XCV200E-6FG456C

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Product attributes Property Value
Manufacturer AMD
Product Series Virtex®-E
Packaging | Tray
Number of LABs/CLBs 1176
Number of Logic Elements/Cells 5292
Total RAM Bits 114688
Number of I/O 284
Number of Gates 306393
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)

AMD XCV200E-6FG456C Virtex-E FPGA Overview

The AMD XCV200E-6FG456C is a high-performance field programmable gate array (FPGA) from the renowned Virtex®-E series, engineered for mission-critical applications requiring exceptional reliability and processing power. This premium-grade FPGA delivers 5,292 logic elements with 284 I/O pins in a compact 456-FBGA surface mount package, making it ideal for aerospace, automotive, industrial control, medical devices, and telecommunications systems.

Key Features & Benefits

  • High Logic Density: 1,176 CLBs and 5,292 logic elements provide extensive programmable resources for complex digital designs
  • Generous Memory: 114,688 total RAM bits enable efficient data buffering and processing
  • Extensive I/O Capability: 284 I/O pins support diverse interface requirements and multi-protocol connectivity
  • Industrial Temperature Range: Operates reliably from 0°C to 85°C (TJ) for demanding environments
  • Stable Power Supply: 1.71V ~ 1.89V voltage range ensures consistent performance
  • Professional Packaging: 456-FBGA (23x23mm) surface mount package optimized for automated assembly

Applications

This Virtex-E FPGA excels in embedded systems requiring reconfigurable logic, high-speed data processing, and long lifecycle availability. Common applications include signal processing, protocol conversion, hardware acceleration, control systems, and custom computing architectures.

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