AMD XCV300-4BG432C4307

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Product attributes Property Value
Manufacturer AMD
Product Series
Packaging Bulk | Bulk
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 65536
Number of I/O 316
Number of Gates 322970
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 432-LBGA Exposed Pad, Metal
Supplier Device Package 432-MBGA (40x40)

AMD XCV300-4BG432C4307 FPGA - High-Performance Programmable Logic Device

The AMD XCV300-4BG432C4307 is a high-density field-programmable gate array (FPGA) designed for demanding industrial, automotive, and aerospace applications. With 6,912 logic elements and 316 I/O pins, this device delivers exceptional flexibility and performance for complex digital designs.

Key Features

  • High Logic Density: 6,912 logic elements across 1,536 LABs/CLBs for complex circuit implementation
  • Extensive I/O Capability: 316 I/O pins for versatile connectivity
  • Generous Memory: 65,536 total RAM bits for data buffering and storage
  • Industrial Temperature Range: Operates reliably from 0°C to 85°C (TJ)
  • Compact Package: 432-MBGA (40x40mm) surface mount package with exposed pad
  • Stable Power Supply: 2.375V to 2.625V operating voltage

Applications

This FPGA is ideal for high-reliability applications including industrial automation, communications infrastructure, automotive electronics, aerospace systems, and embedded control systems requiring programmable logic with extensive I/O capabilities.

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