AMD XCV300-4FG456C
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,874.90 | Dhs. 355,874.90 |
| 15+ | Dhs. 344,636.75 | Dhs. 5,169,551.25 |
| 25+ | Dhs. 337,144.64 | Dhs. 8,428,616.00 |
| 50+ | Dhs. 318,414.39 | Dhs. 15,920,719.50 |
| 100+ | Dhs. 280,953.87 | Dhs. 28,095,387.00 |
| N+ | Dhs. 56,190.77 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Virtex® |
| Packaging | | Tray |
| Number of LABs/CLBs | 1536 |
| Number of Logic Elements/Cells | 6912 |
| Total RAM Bits | 65536 |
| Number of I/O | 312 |
| Number of Gates | 322970 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 456-BBGA |
| Supplier Device Package | 456-FBGA (23x23) |
AMD Virtex® XCV300-4FG456C FPGA - High-Performance Field Programmable Gate Array
The XCV300-4FG456C is a premium-grade Field Programmable Gate Array (FPGA) from AMD's renowned Virtex® series, engineered for mission-critical applications requiring exceptional reliability and performance. This advanced FPGA delivers 6,912 logic elements and 312 I/O pins in a compact 456-FBGA surface mount package, making it ideal for aerospace, industrial control, telecommunications, and embedded systems.
Key Features & Benefits
- High Logic Density: 1,536 LABs/CLBs with 6,912 logic elements for complex digital designs
- Generous Memory: 65,536 total RAM bits for data buffering and processing
- Extensive I/O Capability: 312 I/O pins supporting diverse interface requirements
- Industrial Temperature Range: Operates reliably from 0°C to 85°C (TJ)
- Stable Power Supply: 2.375V to 2.625V voltage range for consistent performance
- Professional Packaging: 456-FBGA (23x23mm) surface mount package for automated assembly
Applications
This Virtex FPGA is perfectly suited for demanding applications including digital signal processing, high-speed data acquisition, industrial automation controllers, telecommunications infrastructure, medical imaging equipment, and aerospace avionics systems where reliability and performance are paramount.
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XCV300-4FG456C.pdf