AMD XCV400-6BG560C

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Product attributes Property Value
Manufacturer AMD
Product Series Virtex®
Packaging | Tray
Number of LABs/CLBs 2400
Number of Logic Elements/Cells 10800
Total RAM Bits 81920
Number of I/O 404
Number of Gates 468252
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 560-LBGA Exposed Pad, Metal
Supplier Device Package 560-MBGA (42.5x42.5)

The AMD Virtex® XCV400-6BG560C is a high-performance field-programmable gate array (FPGA) designed for demanding embedded and mission-critical applications. This industrial-grade FPGA delivers exceptional logic density with 468,252 gates, 10,800 logic elements, and 81,920 total RAM bits, making it ideal for complex digital signal processing, telecommunications infrastructure, aerospace systems, and advanced control applications.

Key Features & Benefits:

  • High I/O Density: 404 configurable I/O pins in a compact 560-MBGA package (42.5x42.5mm)
  • Robust Logic Resources: 2,400 LABs/CLBs providing flexible architecture for custom logic implementation
  • Industrial Temperature Range: Operates reliably from 0°C to 85°C (TJ) for harsh environments
  • Surface Mount Technology: Enables automated assembly and high-density PCB layouts
  • Proven Virtex Architecture: AMD's trusted FPGA platform with extensive design tool support

Applications:

This FPGA is well-suited for aerospace avionics, industrial automation controllers, medical imaging equipment, telecommunications base stations, and automotive safety systems where reliability and performance are critical.

Technical Specifications:

Related Products & Resources:

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