AMD XCV600E-6FG676I

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Product attributes Property Value
Manufacturer AMD
Product Series Virtex®-E
Packaging | Tray
Number of LABs/CLBs 3456
Number of Logic Elements/Cells 15552
Total RAM Bits 294912
Number of I/O 444
Number of Gates 985882
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)

AMD XCV600E-6FG676I Virtex-E FPGA Overview

The XCV600E-6FG676I is a high-performance Field Programmable Gate Array (FPGA) from AMD's renowned Virtex®-E family, engineered for demanding embedded and mission-critical applications. This industrial-grade FPGA delivers exceptional logic density with 985,882 gates and 15,552 logic elements, making it ideal for complex digital signal processing, telecommunications, aerospace, automotive, and industrial control systems.

Key Features & Benefits

  • High Logic Density: 3,456 LABs/CLBs and 15,552 logic elements provide ample resources for sophisticated designs
  • Extensive I/O Capability: 444 I/O pins enable flexible interfacing with multiple peripherals and subsystems
  • Generous Memory: 294,912 total RAM bits support data-intensive applications
  • Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ), perfect for harsh environments
  • Surface Mount Package: 676-BGA (27x27mm) footprint optimized for high-density PCB layouts
  • Stable Power Supply: 1.71V to 1.89V operating voltage ensures consistent performance

Applications

This Virtex-E FPGA excels in aerospace avionics, automotive safety systems, medical imaging equipment, telecommunications infrastructure, industrial automation controllers, and high-reliability embedded computing platforms where long lifecycle availability and proven reliability are paramount.


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