AMD XCV812E-6BG560C

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Product attributes Property Value
Manufacturer AMD
Product Series Virtex®-E EM
Packaging | Tray
Number of LABs/CLBs 4704
Number of Logic Elements/Cells 21168
Total RAM Bits 1146880
Number of I/O 404
Number of Gates 254016
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 560-LBGA Exposed Pad, Metal
Supplier Device Package 560-MBGA (42.5x42.5)

The AMD XCV812E-6BG560C is a high-performance Virtex®-E EM FPGA designed for mission-critical applications in aerospace, automotive, industrial, medical, and telecommunications sectors. With 21,168 logic elements, 404 I/O pins, and over 1.1 million RAM bits, this FPGA delivers exceptional processing power and flexibility for complex embedded systems.

This engineering-grade component features a 560-MBGA package with exposed pad metal construction, ensuring superior thermal performance and reliability in demanding environments. Operating across a wide temperature range (0°C to 85°C TJ) with a stable voltage supply of 1.71V to 1.89V, the XCV812E-6BG560C is built for long lifecycle availability and consistent performance.

Key Applications:

  • High-speed data processing and signal conditioning
  • Advanced control systems and automation
  • Telecommunications infrastructure
  • Medical imaging and diagnostic equipment
  • Aerospace and defense systems

Why Choose HQICKEY? We specialize in premium semiconductor components with guaranteed authenticity, global distribution, and expert technical support for your mission-critical projects.

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