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XCVC1502-1LLIVSVA1596

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AMD Versal™ AI Core FPGA - XCVC1502-1LLIVSVA1596

The XCVC1502-1LLIVSVA1596 is a high-performance Versal™ AI Core FPGA from AMD, designed for demanding applications in industrial, automotive, aerospace, communications, and edge computing environments. This advanced System-on-Chip (SoC) combines powerful processing capabilities with flexible FPGA fabric, delivering exceptional performance and adaptability.

Key Features

  • Dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ for high-performance computing
  • Dual ARM® Cortex™-R5F real-time processors with CoreSight™ for deterministic control
  • 80,000 Logic Cells providing extensive programmable logic resources
  • Advanced Connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART/USART, MMC/SD/SDIO
  • High-Speed Peripherals: DDR memory interface, DMA, PCIe for data-intensive applications
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
  • Compact 1596-BGA Package: 37.5mm x 37.5mm footprint

Applications

Ideal for industrial automation, automotive ADAS systems, aerospace avionics, 5G communications infrastructure, edge AI processing, and high-performance embedded computing applications requiring both processing power and FPGA flexibility.

For complete technical documentation, datasheets, and design resources, please refer to the AMD Versal AI Core documentation.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ Prime FPGA, 80k Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1596-BFBGA
Supplier Device Package 1596-BGA (37.5x37.5)

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