AMD XCVC1502-1LLIVSVA2197

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AMD Versal™ AI Core XCVC1502-1LLIVSVA2197 FPGA

The AMD XCVC1502-1LLIVSVA2197 is a high-performance Versal™ AI Core series FPGA designed for demanding industrial, automotive, aerospace, and communications applications. This advanced system-on-chip combines 80,000 logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors, delivering exceptional processing power and flexibility for complex embedded systems.

Key Features

  • 80k Logic Cells – Versal™ Prime FPGA architecture for scalable, high-density designs
  • Dual-Core Processing – ARM® Cortex®-A72 MPCore™ (1GHz) + ARM® Cortex™-R5F (400MHz) with CoreSight™ debug
  • Industrial Temperature Range – Operates reliably from -40°C to 100°C (TJ)
  • Rich Connectivity – CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART/USART, MMC/SD/SDIO
  • High-Speed Peripherals – DDR memory controller, DMA, PCIe interface
  • Compact BGA Package – 2197-FCBGA (45x45mm) for space-constrained designs

Applications

Ideal for aerospace avionics, automotive ADAS and infotainment, industrial automation, 5G/communications infrastructure, edge AI processing, and high-reliability embedded systems requiring long-term availability and full documentation support.

Documentation: Full datasheets, reference designs, and technical documentation available from AMD. RoHS compliant. Long-term availability for production designs.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ Prime FPGA, 80k Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)