XCVC1502-1LSENSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 59,228.98 AED | Dhs. 59,228.98 AED |
| 15+ | Dhs. 57,358.59 AED | Dhs. 860,378.85 AED |
| 25+ | Dhs. 56,111.66 AED | Dhs. 1,402,791.50 AED |
| 50+ | Dhs. 52,994.35 AED | Dhs. 2,649,717.50 AED |
| 100+ | Dhs. 46,759.72 AED | Dhs. 4,675,972.00 AED |
| N+ | Dhs. 9,351.94 AED | Price Inquiry |
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The AMD XCVC1502-1LSENSVG1369 is a high-performance Versal AI Core FPGA System-on-Chip designed for demanding industrial, automotive, aerospace, and edge computing applications. This advanced SoC combines 80,000 logic cells with dual ARM Cortex-A72 MPCore processors running at 1GHz and dual ARM Cortex-R5F processors at 400MHz, delivering exceptional processing power and flexibility. With comprehensive connectivity options including Ethernet, PCIe, USB OTG, CANbus, and DDR memory interfaces, this device provides a complete solution for complex embedded systems. The industrial-grade temperature range (0°C to 100°C) ensures reliable operation in challenging environments.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 80k Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |

XCVC1502-1LSENSVG1369.pdf