AMD XCVC1502-1LSIVSVA2197

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AMD Versal AI Core XCVC1502-1LSIVSVA2197 FPGA System-on-Chip

The AMD Versal AI Core XCVC1502 represents a breakthrough in adaptive computing, combining high-performance FPGA fabric with dual ARM Cortex-A72 and Cortex-R5F processors. Engineered for demanding industrial, automotive, aerospace, and edge computing applications, this SoC delivers exceptional processing power and flexibility in a compact 2197-FCBGA package.

Key Features & Benefits

  • Dual ARM Cortex-A72 MPCore running at 1GHz with CoreSight debug capabilities
  • Dual ARM Cortex-R5F real-time processors at 400MHz for deterministic control
  • 80,000 Logic Cells providing extensive FPGA fabric for custom acceleration
  • Advanced Connectivity: PCIe, DDR, Ethernet, CANbus, USB OTG, SPI, I2C, UART/USART
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
  • Comprehensive Peripherals: DMA, MMC/SD/SDIO, EBI/EMI for versatile system integration

Ideal Applications

Perfect for AI inference at the edge, industrial automation, automotive ADAS systems, aerospace avionics, 5G communications infrastructure, and high-performance embedded vision processing. The Versal AI Core architecture enables developers to accelerate workloads with hardware-adaptive compute while maintaining software programmability.

Backed by AMD's comprehensive development tools and documentation. Authentic components with full traceability and quality assurance.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ Prime FPGA, 80k Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)