AMD XCVC1502-2MLEVSVA2197

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AMD Versal™ AI Core XCVC1502-2MLEVSVA2197 FPGA

High-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This Versal AI Core device combines adaptive computing with embedded processing and AI acceleration capabilities.

Key Features

  • 800k Logic Cells - Extensive programmable fabric for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ - High-performance application processing at 1.4GHz
  • Dual ARM® Cortex™-R5F with CoreSight™ - Real-time processing at 600MHz
  • 256KB RAM - Integrated memory for efficient data handling
  • Advanced Connectivity - PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range - Operates reliably from 0°C to 110°C (TJ)
  • 2197-FCBGA Package - Compact 45x45mm form factor

Applications

Ideal for high-performance embedded systems requiring adaptive computing, AI acceleration, and real-time processing in harsh environments. Perfect for aerospace instrumentation, automotive ADAS, industrial automation, 5G infrastructure, and edge AI deployments.

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Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 800k Logic Cells
Operating Temperature 0°C ~ 110°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)