AMD XCVC1502-2MLINSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 92,537.91 | Dhs. 92,537.91 |
| 15+ | Dhs. 89,615.65 | Dhs. 1,344,234.75 |
| 25+ | Dhs. 87,667.48 | Dhs. 2,191,687.00 |
| 50+ | Dhs. 82,797.06 | Dhs. 4,139,853.00 |
| 100+ | Dhs. 73,056.23 | Dhs. 7,305,623.00 |
| N+ | Dhs. 14,611.25 | Price Inquiry |
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AMD Versal™ AI Core FPGA - XCVC1502-2MLINSVG1369
The AMD XCVC1502-2MLINSVG1369 represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded ARM processors in a single heterogeneous device. This Versal™ AI Core FPGA delivers 800,000 logic cells alongside dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ (1.4GHz) and dual ARM® Cortex™-R5F processors (600MHz), enabling unprecedented flexibility for demanding industrial, automotive, aerospace, and communications applications.
Why Choose XCVC1502-2MLINSVG1369?
- Massive Logic Capacity: 800k logic cells provide the resources needed for complex FPGA designs, AI acceleration, and real-time signal processing
- Heterogeneous Processing: Dual ARM Cortex-A72 application processors (1.4GHz) handle high-level OS and applications while dual Cortex-R5F real-time processors (600MHz) manage deterministic control tasks
- Integrated Memory: 256KB on-chip RAM reduces latency and external component count
- Comprehensive Connectivity: Native support for PCIe, Gigabit Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART enables seamless integration into existing systems
- Industrial-Grade Reliability: Extended temperature range (-40°C to 110°C TJ) ensures operation in harsh environments
- Advanced Peripherals: DDR memory controller, DMA engines, and MMC/SD/SDIO interfaces accelerate data movement
- RoHS Compliant: Meets environmental standards for global deployment
Target Applications:
- Edge AI & Machine Learning: Deploy neural network inference at the edge with low latency and high throughput
- Automotive Systems: ADAS, autonomous driving compute platforms, in-vehicle networking, and sensor fusion
- Aerospace & Defense: Avionics, radar processing, secure communications, and mission-critical instrumentation
- Industrial Automation: Motion control, machine vision, predictive maintenance, and Industry 4.0 applications
- 5G/6G Infrastructure: Baseband processing, beamforming, and software-defined radio implementations
- High-Performance Computing: Hardware acceleration for compute-intensive workloads
Authorized Distributor Benefits:
- 100% authentic AMD components with full manufacturer traceability
- Complete technical documentation and reference designs
- Long lifecycle availability to support multi-year programs
- Global shipping through authorized channels
- Design-in support and technical resources
Package Details: 1369-FCBGA (Fine-pitch Ball Grid Array), 35mm x 35mm footprint, suitable for high-density PCB designs.
Documentation & Support: Full datasheets, reference manuals, development tools, and design resources available. Contact us for technical consultation and volume pricing.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.4GHz |
| Primary Attributes | Versal™ AI Core FPGA, 800k Logic Cells |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| ROHS |  |
XCVC1502-2MLINSVG1369.pdf