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XCVC1702-1LLINSVG1369
Regular price
Dhs. 107,879.90
Regular price
Dhs. 113,557.77
Sale price
Dhs. 107,879.90
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 107,879.90 AED | Dhs. 107,879.90 AED |
| 15+ | Dhs. 104,473.15 AED | Dhs. 1,567,097.25 AED |
| 25+ | Dhs. 102,201.99 AED | Dhs. 2,555,049.75 AED |
| 50+ | Dhs. 96,524.10 AED | Dhs. 4,826,205.00 AED |
| 100+ | Dhs. 85,168.33 AED | Dhs. 8,516,833.00 AED |
| N+ | Dhs. 17,033.67 AED | Price Inquiry |
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AMD Versal™ AI Core XCVC1702-1LLINSVG1369 FPGA
High-performance System-on-Chip (SoC) FPGA designed for demanding industrial, automotive, aerospace, communications, and edge computing applications. This Versal AI Core device combines adaptive computing with embedded processing and AI acceleration capabilities.
Key Features
- 1 Million Logic Cells - Extensive FPGA fabric for complex designs
- Dual ARM® Cortex®-A72 MPCore™ - High-performance application processing at 1GHz
- Dual ARM® Cortex™-R5F - Real-time processing at 400MHz with CoreSight™ debug
- Rich Connectivity - DDR, PCIe, Ethernet, CANbus, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
- Compact 1369-FCBGA Package - 35x35mm footprint for space-constrained designs
Applications
Ideal for advanced embedded systems requiring high-performance processing, adaptive logic, and AI acceleration in industrial automation, automotive ADAS, aerospace avionics, 5G communications infrastructure, and edge computing platforms.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
XCVC1702-1LLINSVG1369.pdf
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