AMD XCVC1702-1LSENSVG1369

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AMD Versal AI Core FPGA - XCVC1702-1LSENSVG1369

The AMD Versal AI Core XCVC1702 represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded processing and AI acceleration capabilities. Engineered for demanding industrial, automotive, aerospace, and edge computing applications, this System-on-Chip delivers unparalleled flexibility and performance.

Key Features & Benefits

  • 1 Million Logic Cells - Massive programmable logic capacity for complex designs
  • Dual ARM Cortex-A72 MPCore - High-performance 1GHz application processors with CoreSight debug
  • Dual ARM Cortex-R5F - Real-time 400MHz processors for deterministic control
  • Advanced Connectivity - PCIe, Ethernet, USB OTG, CANbus, DDR, SPI, I2C, UART interfaces
  • Industrial Temperature Range - Reliable operation from 0°C to 100°C (TJ)
  • Compact 1369-FCBGA Package - Space-efficient 35x35mm footprint for high-density designs

Ideal Applications

Perfect for AI/ML inference acceleration, software-defined radio, 5G wireless infrastructure, autonomous vehicle systems, industrial automation, aerospace avionics, high-speed data acquisition, and edge computing platforms requiring adaptive hardware acceleration.

Backed by AMD's industry-leading support and comprehensive development tools including Vivado Design Suite and Vitis AI framework.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ AI Core
Packaging Tray | Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)