XCVC1702-1LSIVSVA2197
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 110,335.55 AED | Dhs. 110,335.55 AED |
| 15+ | Dhs. 106,851.26 AED | Dhs. 1,602,768.90 AED |
| 25+ | Dhs. 104,528.40 AED | Dhs. 2,613,210.00 AED |
| 50+ | Dhs. 98,721.27 AED | Dhs. 4,936,063.50 AED |
| 100+ | Dhs. 87,107.00 AED | Dhs. 8,710,700.00 AED |
| N+ | Dhs. 17,421.40 AED | Price Inquiry |
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AMD Versal AI Core FPGA - XCVC1702-1LSIVSVA2197
The AMD Versal AI Core XCVC1702 represents the pinnacle of adaptive computing technology, combining high-performance FPGA fabric with embedded processing capabilities. Engineered for demanding industrial, automotive, aerospace, and communications applications, this System-on-Chip delivers exceptional computational power and flexibility for next-generation edge computing, AI inference acceleration, and software-defined networking solutions.
Key Features & Benefits
- Massive Logic Capacity: 1 million logic cells provide extensive programmable resources for complex designs and multi-function integration
- Dual Processing Cores: ARM Cortex-A72 MPCore (1GHz) and Cortex-R5F (400MHz) with CoreSight debug capabilities enable heterogeneous processing architectures
- Advanced Connectivity: Comprehensive peripheral support including PCIe Gen4, DDR4/LPDDR4, Gigabit Ethernet, CANbus, USB OTG, and multiple serial interfaces (UART, SPI, I2C)
- Industrial-Grade Reliability: Extended temperature range (-40°C to 100°C TJ) ensures operation in harsh environments and mission-critical applications
- Compact High-Density Package: 2197-FCBGA (45x45mm) optimizes board space while maintaining robust thermal performance and signal integrity
- AI Engine Integration: Versal AI Core architecture accelerates machine learning inference and DSP-intensive workloads
- Secure Boot & Encryption: Built-in security features protect intellectual property and ensure trusted execution
Ideal Applications
Perfect for edge computing platforms, AI inference acceleration, software-defined networking (SDN), advanced driver assistance systems (ADAS), aerospace avionics, 5G wireless infrastructure, high-performance embedded vision systems, industrial automation, medical imaging equipment, and radar/signal processing applications.
Why Choose This FPGA?
The XCVC1702 delivers unmatched versatility for system architects requiring adaptive computing power. Its heterogeneous processing architecture combines the flexibility of FPGA fabric with the efficiency of dedicated ARM processors, enabling optimal workload distribution and power efficiency. The AI Engine array accelerates machine learning inference tasks, making it ideal for intelligent edge devices that require real-time decision-making capabilities.
Development & Support
Fully supported by AMD Vivado Design Suite and Vitis unified software platform, enabling rapid prototyping and deployment. Comprehensive documentation, reference designs, and IP cores available through AMD's developer ecosystem.
Authenticity Guaranteed: All AMD Versal devices are sourced directly from authorized distributors with full traceability, manufacturer warranty support, and compliance documentation. Each unit includes certificate of conformance and anti-counterfeit verification.
Technical Documentation: Complete datasheets, application notes, and design guides available. Contact our technical support team for design consultation and integration assistance.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ AI Core |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |

XCVC1702-1LSIVSVA2197.pdf