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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCVC1702-2HSINSVG1369
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 112,385.13 AED | Dhs. 112,385.13 AED |
| 15+ | Dhs. 108,836.11 AED | Dhs. 1,632,541.65 AED |
| 25+ | Dhs. 106,470.11 AED | Dhs. 2,661,752.75 AED |
| 50+ | Dhs. 100,555.10 AED | Dhs. 5,027,755.00 AED |
| 100+ | Dhs. 88,725.09 AED | Dhs. 8,872,509.00 AED |
| N+ | Dhs. 17,745.02 AED | Price Inquiry |
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AMD XCVC1702-2HSINSVG1369 Versal™ AI Core FPGA
The AMD XCVC1702-2HSINSVG1369 is a high-performance Versal™ AI Core FPGA featuring 1 million logic cells, dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™, and dual ARM® Cortex™-R5F processors with CoreSight™. This advanced system-on-chip (SoC) combines adaptive computing with embedded processing, delivering exceptional performance for aerospace, automotive, industrial, and telecommunications applications.
Key Features
- 1M Logic Cells – Extensive programmable logic resources for complex designs
- Dual ARM Cortex-A72 MPCore (1.65GHz) – High-performance application processing
- Dual ARM Cortex-R5F (800MHz) – Real-time processing with CoreSight debug
- 256KB RAM – Integrated memory for efficient data handling
- Advanced Connectivity – PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART
- Industrial Temperature Range – -40°C to +110°C (TJ) for harsh environments
- 1369-FCBGA Package – 35x35mm fine-pitch ball grid array
Applications
Ideal for AI/ML acceleration, 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial automation, aerospace & defense systems, high-performance computing, and edge AI processing.
Authorized Distributor Benefits
We provide 100% authentic AMD components with full manufacturer documentation, traceability certificates, and long lifecycle availability support. All units ship from authorized distributor stock with comprehensive technical resources and design-in support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Virtex® UltraScale+™ |
| Packaging | Bulk | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz, 1.65GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
